High efficiency single-phase AC/DC converter for DC distribution systems
Carregando...
Data
Título da Revista
ISSN da Revista
Título de Volume
Editor
Universidade Federal de Minas Gerais
Descrição
Tipo
Artigo de evento
Título alternativo
Primeiro orientador
Membros da banca
Resumo
The present work aims at performing the design of a high-efficiency interlinking converter for DC distribution systems and to evaluate the impact of the design parameters on the converter efficiency curve. The design method employed the PSIM Thermal Module to estimate the power losses of the switches and a MATLAB inductor sizing routine was built for inductor design and power loss calculation. To evaluate and decide on the best design parameters, the entire load/generation curve was taken into account leading to a converter with efficiency above 98%. To achieve this, it was observed that low switching frequency, dc link voltage at 500V, thermal design with lower junction temperature, and EMI and output filter designs with low current ripple were necessary to improve the efficiency of the proposed converter.
Abstract
Assunto
Eletrônica de potência, Conversores eletrônicos
Palavras-chave
High-efficiency Converters, SiC MOSFET, Power system measurements , Costs , Density measurement , Switching frequency , Prototypes , Voltage , Inductors, Inductor Design, High-efficiency converters , SiC MOSFETs , Microgrids , Inductor design, Conversion Efficiency , Design Parameters , Power Loss , Switching Frequency , Filter Design , Switching Loss , Dc-link Voltage , Efficiency Curve , DC Link , Junction Temperature , Thermal Design , Low Switching Frequency , Inductor Design , Power Density , Influence Of Parameters , Figure Of Merit , Silicon Carbide , Microgrid , Equivalent Resistance , Current Loop , Wide Bandgap Semiconductor , Gallium Nitride , Silicon Carbide MOSFET , Light Load , Dc-link Capacitor , Gate Driver , Voltage Ripple , Open-loop Transfer Function , Variable Switching Frequency
Citação
Departamento
Curso
Endereço externo
https://ieeexplore.ieee.org/document/10374725