Reliable integration of thermal flow sensors into air data systems
Carregando...
Data
Autor(es)
Título da Revista
ISSN da Revista
Título de Volume
Editor
Universidade Federal de Minas Gerais
Descrição
Tipo
Artigo de evento
Título alternativo
Primeiro orientador
Membros da banca
Resumo
Having in mind its impact on the security of air flight applications, there is a high demand for robust and reliable airspeed measurement systems. Thermal flow sensors are a recent proposal in order to circumvent the critical limitations of classic airspeed sensors and have the potential to considerably enhance the security of future aircrafts. This paper is a step towards the application of these sensors and explores how existing state-of-the-art reliability techniques can be applied for this new class of devices. Therefore, a detailed simulation model of a thermal flow sensors is setup in a redundant manner and widely applied voting mechanism are added to the system. Using extensive fault simulations, we explored the applicability of each mechanism for different fault classes and determined the most reliable solution. Results indicate that not the most complex but a more simpler method based on median estimation shows the highest robustness for this new kind of airspeed sensors.
Abstract
Assunto
Teoria do controle, Vôo
Palavras-chave
Thermal sensors , Electron tubes , Atmospheric modeling , Reliability , Sensor systems , Aircraft, Air Data Systems , Robustness , Reliability , Redundancy , Data Acquisition , Airspeed , Thermal Flow Sensors, Thermal Flow Sensor , Sensor Applications , Thermal Sensors , Limitations Of Sensors , Class Of Devices , Impedance , Airflow , Flow Direction , Average Error , Input Signal , Processing Unit , Electrical Signals , Objective Of This Work , Aerodynamic , Airplane , Types Of Defects , Simulation Cases , Fault Location , Speed Measurement , Total Pressure , Sensor Faults , Pitot Tube , Sensor Output , Thermopile , Fault Detection Algorithm
Citação
Departamento
Curso
Endereço externo
https://ieeexplore.ieee.org/document/8692059