Microtensile bond strength of composite resin and glass ionomer cement with total-etching or self-etching universal adhesive

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dc.creatorLaís Sant'ana .Munari
dc.creatorAlberto Nogueira da Gama Antunes
dc.creatorDébora Drummond Hauss Monteiro
dc.creatorAllyson Nogueira Moreira
dc.creatorHugo Henriques Alvim
dc.creatorCláudia Silami Magalhães
dc.date.accessioned2022-12-14T21:07:07Z
dc.date.accessioned2025-09-09T01:20:18Z
dc.date.available2022-12-14T21:07:07Z
dc.date.issued2018-04
dc.format.mimetypepdf
dc.identifier.doihttps://doi.org/10.1016/j.ijadhadh.2017.12.013
dc.identifier.issn01437496
dc.identifier.urihttps://hdl.handle.net/1843/48001
dc.languageeng
dc.publisherUniversidade Federal de Minas Gerais
dc.relation.ispartofInternational Journal of Adhesion and Adhesives
dc.rightsAcesso Restrito
dc.subjectAcids
dc.subjectGlass ionomer cements
dc.subjectComposite resins
dc.subjectTraction
dc.subject.otherComposites
dc.subject.otherMicro-tensile
dc.subject.otherTotal-etch
dc.subject.otherUniversal adhesive
dc.titleMicrotensile bond strength of composite resin and glass ionomer cement with total-etching or self-etching universal adhesive
dc.typeArtigo de periódico
local.citation.epage40
local.citation.spage36
local.citation.volume82
local.description.resumoPurpose To assess the effect of acid etching (AE) and adhesive systems on the microtensile bond strength of conventional glass ionomer cement (GIC) and a nanofilled composite resin. Materials and methods Specimens of conventional GIC (RIVA, Self-cure, SDI) were prepared in a bipartite Teflon mold and randomly assigned (n=12) to G1- GIC+Single Bond 2 (SB2) (3M-ESPE); G2- GIC+Acid etching (AE) (37% phosphoric acid, Condac, FGM) + SB2; G3- GIC+Single Bond Universal (SBU) (3M-ESPE); and G4- GIC+AE+SBU. The adhesive systems and the composite (Filtek Z350XT, 3M-ESPE) were inserted into the mold. After 7 days stored in a humid environment, the specimens were sectioned into five slices (Isomet 1000, Buehler). Hourglass slices were trimmed and subjected to microtensile bond strength testing (BISCO®; Schaumburg, USA) with 0.5 mm/min crosshead speed. Data were analyzed by two-way ANOVA and the Tukey test (SPSS 17.0, α=5%). Results The microtensile bond strength (MPa) means (standard deviation) were G1=9.46(3.79), G2=6.27(3.21), G3=9.35(3.91), and G4=10.13(3.53). G2 differed significantly from the other groups (p<0.001). G1, G3 and G4 were not significantly different from each other (p>0.05). There were 83% mixed fractures, 9.5% cohesive and 7.5% adhesive. Conclusion GIC etching promoted higher microtensile bond strength with universal adhesive than with a total-etch adhesive system. Acid etching is not necessary to enhance the universal adhesive bond strength and negatively affected the bond strength of the total-etch adhesive system. Without etching the GIC, there is no difference in microtensile bond strength between the adhesive systems
local.publisher.countryBrasil
local.publisher.departmentFAO - DEPARTAMENTO DE ODONTOLOGIA RESTAURADORA
local.publisher.initialsUFMG
local.url.externahttps://www.sciencedirect.com/science/article/pii/S0143749617302300

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