Please use this identifier to cite or link to this item: http://hdl.handle.net/1843/48001
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dc.creatorLaís Sant'ana .Munaript_BR
dc.creatorAlberto Nogueira da Gama Antunespt_BR
dc.creatorDébora Drummond Hauss Monteiropt_BR
dc.creatorAllyson Nogueira Moreirapt_BR
dc.creatorHugo Henriques Alvimpt_BR
dc.creatorCláudia Silami Magalhãespt_BR
dc.date.accessioned2022-12-14T21:07:07Z-
dc.date.available2022-12-14T21:07:07Z-
dc.date.issued2018-04-
dc.citation.volume82pt_BR
dc.citation.spage36pt_BR
dc.citation.epage40pt_BR
dc.identifier.doihttps://doi.org/10.1016/j.ijadhadh.2017.12.013pt_BR
dc.identifier.issn01437496pt_BR
dc.identifier.urihttp://hdl.handle.net/1843/48001-
dc.description.resumoPurpose To assess the effect of acid etching (AE) and adhesive systems on the microtensile bond strength of conventional glass ionomer cement (GIC) and a nanofilled composite resin. Materials and methods Specimens of conventional GIC (RIVA, Self-cure, SDI) were prepared in a bipartite Teflon mold and randomly assigned (n=12) to G1- GIC+Single Bond 2 (SB2) (3M-ESPE); G2- GIC+Acid etching (AE) (37% phosphoric acid, Condac, FGM) + SB2; G3- GIC+Single Bond Universal (SBU) (3M-ESPE); and G4- GIC+AE+SBU. The adhesive systems and the composite (Filtek Z350XT, 3M-ESPE) were inserted into the mold. After 7 days stored in a humid environment, the specimens were sectioned into five slices (Isomet 1000, Buehler). Hourglass slices were trimmed and subjected to microtensile bond strength testing (BISCO®; Schaumburg, USA) with 0.5 mm/min crosshead speed. Data were analyzed by two-way ANOVA and the Tukey test (SPSS 17.0, α=5%). Results The microtensile bond strength (MPa) means (standard deviation) were G1=9.46(3.79), G2=6.27(3.21), G3=9.35(3.91), and G4=10.13(3.53). G2 differed significantly from the other groups (p<0.001). G1, G3 and G4 were not significantly different from each other (p>0.05). There were 83% mixed fractures, 9.5% cohesive and 7.5% adhesive. Conclusion GIC etching promoted higher microtensile bond strength with universal adhesive than with a total-etch adhesive system. Acid etching is not necessary to enhance the universal adhesive bond strength and negatively affected the bond strength of the total-etch adhesive system. Without etching the GIC, there is no difference in microtensile bond strength between the adhesive systemspt_BR
dc.format.mimetypepdfpt_BR
dc.languageengpt_BR
dc.publisherUniversidade Federal de Minas Geraispt_BR
dc.publisher.countryBrasilpt_BR
dc.publisher.departmentFAO - DEPARTAMENTO DE ODONTOLOGIA RESTAURADORApt_BR
dc.publisher.initialsUFMGpt_BR
dc.relation.ispartofInternational Journal of Adhesion and Adhesivespt_BR
dc.rightsAcesso Restritopt_BR
dc.subjectCompositespt_BR
dc.subjectMicro-tensilept_BR
dc.subjectTotal-etchpt_BR
dc.subjectUniversal adhesivept_BR
dc.subject.otherAcidspt_BR
dc.subject.otherGlass ionomer cementspt_BR
dc.subject.otherComposite resinspt_BR
dc.subject.otherTractionpt_BR
dc.titleMicrotensile bond strength of composite resin and glass ionomer cement with total-etching or self-etching universal adhesivept_BR
dc.typeArtigo de Periódicopt_BR
dc.url.externahttps://www.sciencedirect.com/science/article/pii/S0143749617302300pt_BR
Appears in Collections:Artigo de Periódico

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